Exx002EV: VPX Chassis (2 to 12 slots)
Exx002EV: VPX Chassis (2 to 12 slots)
VPX Ecosystem
Versatile, ruggedized, conduction cooled enclosure for single and dual string (redundant) 3U VPX systems.
Main features
- Rugged chassis specially designed for high reliability space applications
- Designed to endure the extreme Thermal, Shock, Vibration conditions of launch vehicles and the outer space
- Designed for >50 W per board
- Fully sealed Faraday cage
- Customizable I/O
- Accommodates up to 12 conductioncooled 3U VPX boards per VITA 65 OpenVPX or VITA 78 SpaceVPX with 1.2-inch pitch
- Low thermal resistance to base plate
- ITAR Free
Downloads
Datasheet
SPECIFICATIONS
Operating Temperature
- -35 to 55 °C at baseplate in vacuum conditions (cond. cooled)
Non-operating Temperature
- -55 to 70 °C
Vibration
- Sine 20 G (max) at 5 to 100 Hz. Random 14.1 GRMS at 20 to 2000 Hz. 3 axes
Shock – SRS (Q=10)
- 28 G peak at 100 Hz. 850 G peak at 1000 Hz
EMI/RFI
- Designed to meet the emission and susceptibility limits of MIL-STD-461, as per MIL-STD-462 requirements, CE102, CS101, CS114 & RE102
Dimensions
- 128.1 x 239.0 x 113.75 mm (L x W x H) (2 slots)
- 189.1 x 239.0 x 113.75 mm (L x W x H) (4 slots)
- 341.5 x 239.0 x 113.75 mm (L x W x H) (9 slots)
Weight (without VPX boards and front/back covers)
- 1.3 kg (2 slots)
- 1.7 kg (4 slots)
- 3.0 kg (9 slots)
Power Dissipation Capability
- Up to 50 W per VPX board at 55 °C baseplate in vacuum
ADDITIONAL FEATURES
- Stepped corner joints (double 90 turns) at each wall interface and EMC gaskets between front panels
- CNC Machined 6061-T6 Aluminum
- M3/M4 stainless-steel fasteners and self-locking, stainless-steel inserts for severe vibration and shock
Related products
SBC003SV
SBC
and 2 more tags
This single board computer is ideal for low power applications. Its main device is a Smartfusion2 from Microsemi, a System on Chip (SOC) that supports a Microcontroller subsystem (including an M3 microcontroller, DDR controller and other peripherals) as well as FPGA fabric in the same device. The inclusion of both a hard microcontroller subsystem as well as a soft FPGA fabric enables great flexibility an essential part of Novo Space's DNA. These FPGA fabric allows software defined architectures and IOs, allowing the support of multiple options for FPGA Mezzanine Cards (FMCs) as well as IO to the backplane.
This is the ideal platform for implementing machine learning using TensorFlow and PyTorch directly on FPGA fabric without modification while keeping a low power consumption.
Backplanes
VPX Ecosystem
Novo Space offers custom and off-the-shelf backplanes in single-string and dual-string topologies.
Novo's cross-strapped high-throughput backplanes are optimized for bandwidth and reliability.
VPX / FMC Shielding
VPX Ecosystem
Novo's components are ruggedized. The mechanical design (optional) is aimed at transferring heat away from the most dissipative electronic components via direct conduction.
The shielding is design to stand the mechanical stress in the launch vehicle, and reduce the radiation exposure in space to sustain the TID required for long missions.